The following information was submitted:
Transactions: INTERNATIONAL JOURNAL of MECHANICS
Transactions ID Number: 20-861
Full Name: Oldrich Suba
Position: Associate Professor
Age: ON
Sex: Male
Address: Tomas Bata University in Zlin, nam. TGM 275, 762 72 Zlin
Country: CZECH REPUBLIC
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E-mail address: suba@ft.utb.cz
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Title of the Paper: Transient of Thermal Stresses in Printed Circuit Boards
Authors as they appear in the Paper: Oldrich Suba,Libuse Sykorova
Email addresses of all the authors: suba@ft.utb.cz,sykorova@ft.utb.cz
Number of paper pages: 8
Abstract: Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
Keywords: Thermal stress,Printed circuit boards,Layered walls
EXTENSION of the file: .doc
Special (Invited) Session: Modelling of Thermal Stresses in Printed Circuit Boards
Organizer of the Session: 655-210
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