The following information was submitted:
Transactions: WSEAS TRANSACTIONS ON APPLIED AND THEORETICAL MECHANICS
Transactions ID Number: 29-339
Full Name: Yong-Ming Guo
Position: Assistant Professor
Age: ON
Sex: Male
Address: Department of Mechanical Engineering, Graduate School of Science and Engineering, Kagoshima University, 1-21-40 Korimoto, Kagoshima City, 890-0065
Country: JAPAN
Tel: +81-(0)99-285-8258
Tel prefix:
Fax: +81-(0)99-250-3181
E-mail address: guoy@mech.kagoshima-u.ac.jp
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Title of the Paper: Numerical simulation of forging process using the hybrid PCM/FEM
Authors as they appear in the Paper: Yong-Ming Guo
Email addresses of all the authors: guoy@mech.kagoshima-u.ac.jp
Number of paper pages: 10
Abstract: In this paper, for analyses of metal forming problems, a point collocation method (PCM) with a boundary layer of finite element is developed. PCMs have some advantages such as no mesh, no integration. While, the robustness of the PCMs is an issue especially when scattered and random points are used. To improve the robustness, some studies suggest that the positivity conditions can be important when using the PCMs. For boundary points, however, the positivity conditions cannot be satisfied, so that it is possible to get large numerical errors from the boundary points when using the PCMs. Specifically, the errors could arise in point collocation analyses with complicated boundary conditions. In this paper, by introducing a boundary layer of finite element in boundary domain of workpiece, unsatisfactory issue of the positivity conditions of boundary points can be avoided, and the complicated boundary conditions can be easily imposed with the boundary layer of finite e!
lement. A forging process is analyzed by using the hybrid PCM/FEM.
Keywords: Meshless method, Point collocation method, Positivity conditions, FEM, Hybrid method, Forging
EXTENSION of the file: .doc
Special (Invited) Session: A Simulation of Forging Process by the Point Collocation Method with a Boundary Layer of Finite Element
Organizer of the Session: 613-410
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