Monday, 26 January 2009

Wseas Transactions

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Transactions: WSEAS TRANSACTIONS ON BIOLOGY AND BIOMEDICINE
Transactions ID Number: 28-791
Full Name: Nicu George Bizdoaca
Position: Professor
Age: ON
Sex: Male
Address: 107 Decebal Bv., Craiova, 200440
Country: ROMANIA
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E-mail address: nicu@robotics.ucv.ro
Other E-mails: apetrisor06@gmail.com
Title of the Paper: Modular Adaptive Bionics Structure
Authors as they appear in the Paper: Nicu George Bîzdoaca , Dan Tarnita, Daniela Tarnita, Anca Petrisor, Elvira Bîzdoaca
Email addresses of all the authors: nicu@robotics.ucv.ro, dantarnita@yahoo.com, dtarnita@yahoo.com, apetrisor@em.ucv.ro, elviranicoleta@yahoo.com
Number of paper pages: 10
Abstract: Applications of biological methods and systems found in nature to the study and design of engineering systems and modern technology are defined as BIONICS. The present paper describes a bionics application of shape memory alloy in construction of orthopedic implant. The main idea of this paper is related to design modular adaptive implants for fractured bones. In order to target the efficiency of medical treatment, the implant has to protect the fractured bone, for the healing period, undertaking much as is possible from the daily usual load of the healthy bones. After a particular stage of healing period is passed, using implant modularity, the load is gradually transferred to bone, assuring in this manner a gradually recover of bone function. The adaptability of this design is related to medical possibility of the doctor to made the implant to correspond to patient specifically anatomy. Using a CT realistic numerical bone models, the mechanical simulation of diff!
erent types of loading of the fractured bones treated with conventional method are presented. The results are commented and conclusions are formulated.
Keywords: Bionics, Modularity, Implants, Numerical simulation, Shape memory alloy
EXTENSION of the file: .pdf
Special (Invited) Session: Shape memory alloy based Modular Adaptive Orthopedic Implants
Organizer of the Session: 595-606
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